Hanmi Semiconductor Establishes US Subsidiary to Capture HBM4 and Onshoring Demand

Hanmi Semiconductor is establishing 'HanmiUSA' to directly target the growing demand for AI memory packaging equipment in the US.

This strategic move is driven by the global HBM4 memory supercycle and the US CHIPS Act, which encourages domestic semiconductor manufacturing.

With a high valuation, the company's key challenge is to quickly convert this US expansion into tangible orders and revenue.

042700.KS

Hanmi Semiconductor's announcement to establish 'HanmiUSA' is a decisive strategic move to capture the surging demand in the AI semiconductor market.

The AI revolution is powered by specialized memory called HBM (High Bandwidth Memory). The upcoming generation, HBM4, requires stacking multiple memory chips with extreme precision, creating a major production bottleneck in the 'packaging' stage. This is where Hanmi's core product, the TC Bonder, comes in. It's a critical piece of equipment for this stacking process. With major players like Samsung and SK hynix ramping up HBM4 production, the demand for high-performance TC Bonders is set to increase significantly.

A second major trend is the onshoring of semiconductor manufacturing in the United States, heavily incentivized by the CHIPS Act. Global giants are building advanced facilities on US soil, including SK hynix's new HBM packaging plant in Indiana. These clients require fast, on-site support, spare parts, and technical expertise to keep their multi-billion dollar production lines running smoothly.

Hanmi's decision to open an office in San Jose, the heart of Silicon Valley, is a direct answer to these two forces. It's not just about selling machines; it's about providing a localized, high-touch service network. Being physically present allows Hanmi to work closely with its customers' R&D and production teams, strengthening relationships and securing a competitive edge for future orders.

This strategic pivot comes as Hanmi's stock price has seen remarkable growth, leading to a very high valuation. This reflects strong investor confidence but also sets high expectations. The success of HanmiUSA will be measured by how quickly it can translate this strategy into concrete orders and revenue, justifying its premium market position.

HBM (High Bandwidth Memory): A type of high-performance memory used in AI accelerators, made by vertically stacking memory chips.
TC Bonder (Thermal Compression Bonder): Equipment that uses heat and pressure to connect and stack semiconductor chips, essential for HBM manufacturing.
Onshoring: The practice of moving business operations and manufacturing from overseas back to the company's home country.